XC3S5000-5FG456C
vs
XC3S2000-4FG456I
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
XILINX INC
|
Package Description |
FBGA-456
|
23 X 23 MM, FBGA-456
|
Reach Compliance Code |
compliant
|
not_compliant
|
Clock Frequency-Max |
725 MHz
|
630 MHz
|
Combinatorial Delay of a CLB-Max |
0.53 ns
|
0.61 ns
|
JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B456
|
JESD-609 Code |
e0
|
e0
|
Length |
23 mm
|
23 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
192
|
5120
|
Number of Equivalent Gates |
50000
|
2000000
|
Number of Inputs |
333
|
333
|
Number of Outputs |
333
|
333
|
Number of Terminals |
456
|
456
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Organization |
192 CLBS, 50000 GATES
|
5120 CLBS, 2000000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.6 mm
|
2.6 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
23 mm
|
23 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
456
|
ECCN Code |
|
3A991.D
|
HTS Code |
|
8542.39.00.01
|
Factory Lead Time |
|
23 Weeks
|
Number of Logic Cells |
|
46080
|
Package Equivalence Code |
|
BGA456,22X22,40
|
Technology |
|
CMOS
|
|
|
|
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