XC3S4000-4FG456C
vs
XC3S4000-4FGG456C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
FBGA-456
LEAD FREE, FBGA-456
Pin Count
456
456
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B456
S-PBGA-B456
JESD-609 Code
e0
e1
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
192
192
Number of Equivalent Gates
50000
50000
Number of Terminals
456
456
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
192 CLBS, 50000 GATES
192 CLBS, 50000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
250
Time@Peak Reflow Temperature-Max (s)
30
Compare XC3S4000-4FG456C with alternatives
Compare XC3S4000-4FGG456C with alternatives