XC3S1600E-5FG400C vs XC3S1600E-4FGG400I feature comparison

XC3S1600E-5FG400C AMD Xilinx

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XC3S1600E-4FGG400I AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-400 FBGA-400
Pin Count 400 400
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks 52 Weeks
Clock Frequency-Max 657 MHz 572 MHz
Combinatorial Delay of a CLB-Max 0.66 ns 0.76 ns
JESD-30 Code S-PBGA-B400 S-PBGA-B400
JESD-609 Code e0 e1
Length 21 mm 21 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3688 3688
Number of Equivalent Gates 1600000 1600000
Number of Inputs 304 304
Number of Logic Cells 33192 33192
Number of Outputs 132 132
Number of Terminals 400 400
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 3688 CLBS, 1600000 GATES 3688 CLBS, 1600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA400,20X20,40 BGA400,20X20,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.43 mm 2.43 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 21 mm 21 mm
Base Number Matches 2 2

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Compare XC3S1600E-4FGG400I with alternatives