XC3S1500-5FG456C
vs
XC3S1400AN-4FGG484C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
23 X 23 MM, FBGA-456
FBGA-484
Pin Count
456
484
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
52 Weeks
Clock Frequency-Max
725 MHz
667 MHz
Combinatorial Delay of a CLB-Max
0.53 ns
0.71 ns
JESD-30 Code
S-PBGA-B456
S-PBGA-B484
JESD-609 Code
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
Number of CLBs
3328
2816
Number of Equivalent Gates
1500000
1400000
Number of Inputs
333
375
Number of Logic Cells
29952
25344
Number of Outputs
333
288
Number of Terminals
456
484
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
3328 CLBS, 1500000 GATES
2816 CLBS, 1400000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA456,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
NOT SPECIFIED
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
23 mm
23 mm
Base Number Matches
1
1
Category CO2 Kg
12.2
Compliance Temperature Grade
Commercial Extended: +0C to +85C
EU RoHS Version
RoHS 2 (2011/65/EU)
Compare XC3S1500-5FG456C with alternatives
Compare XC3S1400AN-4FGG484C with alternatives