XC3S1400AN-5FG484C
vs
XC3S1400A-4FG484C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
FBGA-484
FBGA-484
Pin Count
484
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
Clock Frequency-Max
770 MHz
667 MHz
Combinatorial Delay of a CLB-Max
0.62 ns
0.71 ns
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2816
2816
Number of Equivalent Gates
1400000
1400000
Number of Inputs
375
375
Number of Logic Cells
25344
25344
Number of Outputs
288
288
Number of Terminals
484
484
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
2816 CLBS, 1400000 GATES
2816 CLBS, 1400000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
Base Number Matches
1
2
Samacsys Manufacturer
AMD
JESD-609 Code
e0
Peak Reflow Temperature (Cel)
225
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
30
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