XC3S1400AN-4FG676I vs XC3S1400A-5FGG676C feature comparison

XC3S1400AN-4FG676I AMD

Buy Now Datasheet

XC3S1400A-5FGG676C AMD Xilinx

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Package Description FBGA-676 FBGA-676
Reach Compliance Code not_compliant compliant
Samacsys Manufacturer AMD
Clock Frequency-Max 667 MHz 770 MHz
Combinatorial Delay of a CLB-Max 0.71 ns 0.62 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e0 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2816 2816
Number of Equivalent Gates 1400000 1400000
Number of Inputs 502 502
Number of Logic Cells 25344 25344
Number of Outputs 408 408
Number of Terminals 676 676
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2816 CLBS, 1400000 GATES 2816 CLBS, 1400000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Pin Count 676
ECCN Code 3A991.D
HTS Code 8542.39.00.01

Compare XC3S1400A-5FGG676C with alternatives