XC3S1400A-4FGG484I
vs
XC3S1500-5FGG456C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ADVANCED MICRO DEVICES INC
Package Description
FBGA-484
23 X 23 MM, LEAD FREE, FBGA-456
Reach Compliance Code
compliant
compliant
Samacsys Manufacturer
AMD
AMD
Clock Frequency-Max
667 MHz
725 MHz
Combinatorial Delay of a CLB-Max
0.71 ns
0.53 ns
JESD-30 Code
S-PBGA-B484
S-PBGA-B456
JESD-609 Code
e1
e1
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2816
3328
Number of Equivalent Gates
1400000
1500000
Number of Inputs
375
333
Number of Logic Cells
25344
29952
Number of Outputs
288
333
Number of Terminals
484
456
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2816 CLBS, 1400000 GATES
3328 CLBS, 1500000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA456,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
2
2