XC3190-4PQ208C vs XC3020-100PQ100C feature comparison

XC3190-4PQ208C Rochester Electronics LLC

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XC3020-100PQ100C AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC XILINX INC
Part Package Code QFP QFP
Package Description PLASTIC, QFP-208 PLASTIC, QFP-100
Pin Count 208 100
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX. 144 I/OS; 928 FLIP-FLOPS; TYP. GATES = 5000 - 7500 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA
Clock Frequency-Max 230 MHz 100 MHz
Combinatorial Delay of a CLB-Max 3.3 ns 7 ns
JESD-30 Code S-PQFP-G208 R-PQFP-G100
Length 28 mm 20 mm
Number of CLBs 320 64
Number of Equivalent Gates 5000 1000
Number of Terminals 208 100
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Organization 320 CLBS, 5000 GATES 64 CLBS, 1000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP QFP
Package Equivalence Code QFP208,1.2SQ,20 QFP100,.7X.9
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, FINE PITCH FLATPACK
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.92 mm 2.87 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD QUAD
Width 28 mm 14 mm
Base Number Matches 2 1
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Inputs 64
Number of Logic Cells 64
Number of Outputs 64
Peak Reflow Temperature (Cel) 225
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

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