XC3164A-4TQG144C vs XC3130-3TQ100C feature comparison

XC3164A-4TQG144C AMD Xilinx

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XC3130-3TQ100C Rochester Electronics LLC

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Rohs Code Yes
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer XILINX INC ROCHESTER ELECTRONICS LLC
Part Package Code QFP QFP
Package Description LFQFP, FQFP,
Pin Count 144 100
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 4500 LOGIC GATES MAX. 80 I/OS; 360 FLIP-FLOPS; TYP. GATES = 2000 - 2700
Clock Frequency-Max 227 MHz 270 MHz
Combinatorial Delay of a CLB-Max 3.3 ns 2.7 ns
JESD-30 Code S-PQFP-G144 S-PQFP-G100
JESD-609 Code e3
Length 20 mm 14 mm
Moisture Sensitivity Level 3
Number of CLBs 224 100
Number of Equivalent Gates 3500 2000
Number of Inputs 120
Number of Outputs 120
Number of Terminals 144 100
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Organization 224 CLBS, 3500 GATES 100 CLBS, 2000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP FQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.6 mm 1.75 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 20 mm 14 mm
Base Number Matches 1 2
Package Equivalence Code QFP100,.63SQ,20
Qualification Status Not Qualified

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Compare XC3130-3TQ100C with alternatives