XC3142-3TQ144C vs XC3090-100PQ160I feature comparison

XC3142-3TQ144C AMD Xilinx

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XC3090-100PQ160I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code QFP QFP
Package Description LFQFP, QFP144,.87SQ,20 QFP, QFP160,1.2SQ
Pin Count 144 160
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX. 96 I/OS; 480 FLIP-FLOPS; TYP. GATES = 3000 - 3700 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA
Clock Frequency-Max 270 MHz 100 MHz
Combinatorial Delay of a CLB-Max 2.7 ns 7 ns
JESD-30 Code S-PQFP-G144 S-PQFP-G160
JESD-609 Code e0 e0
Length 20 mm 28 mm
Moisture Sensitivity Level 3 3
Number of CLBs 144 320
Number of Equivalent Gates 3000 5000
Number of Inputs 96 138
Number of Logic Cells 144 320
Number of Outputs 96 138
Number of Terminals 144 160
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 144 CLBS, 3000 GATES 320 CLBS, 5000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Equivalence Code QFP144,.87SQ,20 QFP160,1.2SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 3.92 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 20 mm 28 mm
Base Number Matches 1 1

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