XC3130-3TQ100C vs XC3164A-4TQG144C feature comparison

XC3130-3TQ100C Rochester Electronics LLC

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XC3164A-4TQG144C AMD Xilinx

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC XILINX INC
Part Package Code QFP QFP
Package Description FQFP, LFQFP,
Pin Count 100 144
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX. 80 I/OS; 360 FLIP-FLOPS; TYP. GATES = 2000 - 2700 MAX USABLE 4500 LOGIC GATES
Clock Frequency-Max 270 MHz 227 MHz
Combinatorial Delay of a CLB-Max 2.7 ns 3.3 ns
JESD-30 Code S-PQFP-G100 S-PQFP-G144
Length 14 mm 20 mm
Number of CLBs 100 224
Number of Equivalent Gates 2000 3500
Number of Terminals 100 144
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Organization 100 CLBS, 2000 GATES 224 CLBS, 3500 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP LFQFP
Package Equivalence Code QFP100,.63SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.75 mm 1.6 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 14 mm 20 mm
Base Number Matches 2 1
Rohs Code Yes
JESD-609 Code e3
Moisture Sensitivity Level 3
Number of Inputs 120
Number of Outputs 120
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

Compare XC3130-3TQ100C with alternatives

Compare XC3164A-4TQG144C with alternatives