XC3090-100PG175C vs XC3090-100PG175C feature comparison

XC3090-100PG175C AMD Xilinx

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XC3090-100PG175C

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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code PGA
Package Description PGA, PGA176,16X16MOD
Pin Count 175
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Additional Feature 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA
Clock Frequency-Max 100 MHz
Combinatorial Delay of a CLB-Max 7 ns
JESD-30 Code S-CPGA-P175
Length 42.164 mm
Number of CLBs 320
Number of Equivalent Gates 5000
Number of Inputs 144
Number of Logic Cells 320
Number of Outputs 144
Number of Terminals 175
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 320 CLBS, 5000 GATES
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Equivalence Code PGA176,16X16MOD
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.81 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V
Surface Mount NO
Technology CMOS
Temperature Grade OTHER
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 42.164 mm
Base Number Matches 3

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