XC3064L-8TQ144I
vs
OR2T06A-3M84I
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
LATTICE SEMICONDUCTOR CORP
|
| Part Package Code |
QFP
|
|
| Package Description |
LFQFP, QFP144,.87SQ,20
|
QCCJ, LDCC84,1.2SQ
|
| Pin Count |
144
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
MAX USABLE 4500 LOGIC GATES
|
|
| Clock Frequency-Max |
80 MHz
|
|
| Combinatorial Delay of a CLB-Max |
6.7 ns
|
2.9 ns
|
| JESD-30 Code |
S-PQFP-G144
|
S-PQCC-J84
|
| JESD-609 Code |
e0
|
e0
|
| Length |
20 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
224
|
|
| Number of Equivalent Gates |
3500
|
6900
|
| Number of Inputs |
120
|
62
|
| Number of Logic Cells |
224
|
576
|
| Number of Outputs |
120
|
62
|
| Number of Terminals |
144
|
84
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
224 CLBS, 3500 GATES
|
144 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
QCCJ
|
| Package Equivalence Code |
QFP144,.87SQ,20
|
LDCC84,1.2SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
225
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
20 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
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