XC3042-50PC84I vs XC3042-70PC84I feature comparison

XC3042-50PC84I AMD Xilinx

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XC3042-70PC84I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code LCC LCC
Package Description PLASTIC, LCC-84 PLASTIC, LCC-84
Pin Count 84 84
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX 74 I/OS; 480 FLIP-FLOPS 480 FLIP-FLOPS; TYP. GATES = 2000-3000; POWER-DOWN SUPPLY CURRENT = 120UA
Clock Frequency-Max 50 MHz 70 MHz
Combinatorial Delay of a CLB-Max 14 ns 9 ns
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e0
Length 29.3116 mm 29.3116 mm
Moisture Sensitivity Level 3 3
Number of CLBs 144 144
Number of Equivalent Gates 4200 2000
Number of Inputs 74 74
Number of Logic Cells 144 144
Number of Outputs 74 74
Number of Terminals 84 84
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 144 CLBS, 4200 GATES 144 CLBS, 2000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.699 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn85Pb15)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 29.3116 mm 29.3116 mm
Base Number Matches 2 2

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Compare XC3042-70PC84I with alternatives