XC3030-125PC84CSPC0107 vs XC3030-50PC84C feature comparison

XC3030-125PC84CSPC0107 AMD Xilinx

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XC3030-50PC84C AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code LCC LCC
Package Description QCCJ, QCCJ, LDCC84,1.2SQ
Pin Count 84 84
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 360 FLIP-FLOPS; TYP. GATES = 1500-2000 MAX 74 I/OS; 360 FLIP-FLOPS
Clock Frequency-Max 125 MHz 50 MHz
Combinatorial Delay of a CLB-Max 5.5 ns 14 ns
JESD-30 Code S-PQCC-J84 S-PQCC-J84
Length 29.3116 mm 29.3116 mm
Number of CLBs 100 100
Number of Equivalent Gates 1500 3000
Number of Inputs 74 74
Number of Outputs 74 74
Number of Terminals 84 84
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Organization 100 CLBS, 1500 GATES 100 CLBS, 3000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.699 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 29.3116 mm 29.3116 mm
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Logic Cells 100
Package Equivalence Code LDCC84,1.2SQ
Peak Reflow Temperature (Cel) 225
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

Compare XC3030-125PC84CSPC0107 with alternatives

Compare XC3030-50PC84C with alternatives