XC3020-70PC84I vs ATT3020-70M84 feature comparison

XC3020-70PC84I AMD Xilinx

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ATT3020-70M84 LSI Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC AT & T MICROELECTRONICS
Part Package Code LCC LCC
Package Description PLASTIC, LCC-84
Pin Count 84 84
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA TYP. GATES = 1000-1500
Clock Frequency-Max 70 MHz 70 MHz
Combinatorial Delay of a CLB-Max 9 ns 9 ns
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e0
Length 29.3116 mm 29.16 mm
Moisture Sensitivity Level 3
Number of CLBs 64 64
Number of Equivalent Gates 1000 1000
Number of Inputs 64 64
Number of Logic Cells 64 64
Number of Outputs 64 64
Number of Terminals 84 84
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64 CLBS, 1000 GATES 64 CLBS, 1000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 29.3116 mm 29.16 mm
Base Number Matches 1 1

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