XC3020-100PQ100C vs XC3090-100PQ160I feature comparison

XC3020-100PQ100C AMD Xilinx

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XC3090-100PQ160I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code QFP QFP
Package Description PLASTIC, QFP-100 QFP, QFP160,1.2SQ
Pin Count 100 160
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA
Clock Frequency-Max 100 MHz 100 MHz
Combinatorial Delay of a CLB-Max 7 ns 7 ns
JESD-30 Code R-PQFP-G100 S-PQFP-G160
JESD-609 Code e0 e0
Length 20 mm 28 mm
Moisture Sensitivity Level 3 3
Number of CLBs 64 320
Number of Equivalent Gates 1000 5000
Number of Inputs 64 138
Number of Logic Cells 64 320
Number of Outputs 64 138
Number of Terminals 100 160
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 64 CLBS, 1000 GATES 320 CLBS, 5000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Equivalence Code QFP100,.7X.9 QFP160,1.2SQ
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK FLATPACK
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.87 mm 3.92 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 14 mm 28 mm
Base Number Matches 1 1

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