XC3020-100PQ100C
vs
OR2T06A-6M84
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
LATTICE SEMICONDUCTOR CORP
Part Package Code
QFP
Package Description
PLASTIC, QFP-100
QCCJ, LDCC84,1.2SQ
Pin Count
100
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA
Clock Frequency-Max
100 MHz
Combinatorial Delay of a CLB-Max
7 ns
1.4 ns
JESD-30 Code
R-PQFP-G100
S-PQCC-J84
JESD-609 Code
e0
e0
Length
20 mm
29.083 mm
Moisture Sensitivity Level
3
3
Number of CLBs
64
Number of Equivalent Gates
1000
6900
Number of Inputs
64
62
Number of Logic Cells
64
576
Number of Outputs
64
62
Number of Terminals
100
84
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
Organization
64 CLBS, 1000 GATES
144 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QCCJ
Package Equivalence Code
QFP100,.7X.9
LDCC84,1.2SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
CHIP CARRIER
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.87 mm
5.08 mm
Supply Voltage-Max
5.25 V
3.6 V
Supply Voltage-Min
4.75 V
3 V
Supply Voltage-Nom
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
14 mm
29.083 mm
Base Number Matches
1
2
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