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XC2VP7-6FFG672C vs XC2VP7-6FF672I feature comparison

XC2VP7-6FFG672C AMD Xilinx

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XC2VP7-6FF672I AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA672,26X26,40 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FCBGA-672
Pin Count 672 672
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1200 MHz 1200 MHz
Combinatorial Delay of a CLB-Max 0.32 ns 0.32 ns
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e1 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 4 4
Number of CLBs 1232 1232
Number of Inputs 396 396
Number of Logic Cells 11088 11088
Number of Outputs 396 396
Number of Terminals 672 672
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1232 CLBS 1232 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA672,26X26,40 BGA672,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 220
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

Compare XC2VP7-6FFG672C with alternatives

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