XC2VP7-5FF896I vs XC2VP7-7FF896C feature comparison

XC2VP7-5FF896I AMD Xilinx

Buy Now Datasheet

XC2VP7-7FF896C AMD Xilinx

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA896,30X30,40 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FCBGA-896
Pin Count 896 896
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1050 MHz 1350 MHz
Combinatorial Delay of a CLB-Max 0.36 ns 0.28 ns
JESD-30 Code S-PBGA-B896 S-PBGA-B896
JESD-609 Code e0 e0
Length 31 mm 31 mm
Moisture Sensitivity Level 4 4
Number of CLBs 1232 1232
Number of Inputs 396 396
Number of Logic Cells 11088 11088
Number of Outputs 396 396
Number of Terminals 896 896
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1232 CLBS 1232 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA896,30X30,40 BGA896,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 31 mm
Base Number Matches 1 1
Temperature Grade OTHER

Compare XC2VP7-5FF896I with alternatives

Compare XC2VP7-7FF896C with alternatives