XC2VP7-5FF896I
vs
XC2VP7-7FFG896C
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA, BGA896,30X30,40
|
BGA, BGA896,30X30,40
|
Pin Count |
896
|
896
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
1050 MHz
|
1350 MHz
|
Combinatorial Delay of a CLB-Max |
0.36 ns
|
0.28 ns
|
JESD-30 Code |
S-PBGA-B896
|
S-PBGA-B896
|
JESD-609 Code |
e0
|
e1
|
Length |
31 mm
|
31 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of CLBs |
1232
|
1232
|
Number of Inputs |
396
|
396
|
Number of Logic Cells |
11088
|
11088
|
Number of Outputs |
396
|
396
|
Number of Terminals |
896
|
896
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
1232 CLBS
|
1232 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA896,30X30,40
|
BGA896,30X30,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
245
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.4 mm
|
3.4 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
31 mm
|
31 mm
|
Base Number Matches |
1
|
1
|
Temperature Grade |
|
OTHER
|
|
|
|
Compare XC2VP7-5FF896I with alternatives
Compare XC2VP7-7FFG896C with alternatives