XC2VP100-5FFG1704I vs XC2VP100-5FF1704C feature comparison

XC2VP100-5FFG1704I AMD Xilinx

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XC2VP100-5FF1704C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA1704,42X42,40 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704
Pin Count 1704 1704
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1050 MHz 1050 MHz
Combinatorial Delay of a CLB-Max 0.36 ns 0.36 ns
JESD-30 Code S-PBGA-B1704 S-PBGA-B1704
JESD-609 Code e1 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of CLBs 11024 11024
Number of Inputs 1040 1040
Number of Logic Cells 99216 99216
Number of Outputs 1040 1040
Number of Terminals 1704 1704
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 11024 CLBS 11024 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1704,42X42,40 BGA1704,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.45 mm 3.45 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Temperature Grade OTHER

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