XC2V8000-5FF1517I vs XC2V8000-4FFG1517I feature comparison

XC2V8000-5FF1517I AMD Xilinx

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XC2V8000-4FFG1517I AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517
Pin Count 1517 1517
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 750 MHz 650 MHz
Combinatorial Delay of a CLB-Max 0.39 ns 0.44 ns
JESD-30 Code S-PBGA-B1517 S-PBGA-B1517
JESD-609 Code e0 e1
Length 40 mm 40 mm
Moisture Sensitivity Level 4 4
Number of CLBs 11648 11648
Number of Equivalent Gates 8000000 8000000
Number of Inputs 1108 1108
Number of Logic Cells 104832 104832
Number of Outputs 1108 1108
Number of Terminals 1517 1517
Organization 11648 CLBS, 8000000 GATES 11648 CLBS, 8000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1517,39X39,40 BGA1517,39X39,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1

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Compare XC2V8000-4FFG1517I with alternatives