XC2V8000-4FF1517C
vs
XC2V8000-5FF1517C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517
40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517
Pin Count
1517
1517
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A001.A.7.A
3A001.A.7.A
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
650 MHz
750 MHz
Combinatorial Delay of a CLB-Max
0.44 ns
0.39 ns
JESD-30 Code
S-PBGA-B1517
S-PBGA-B1517
JESD-609 Code
e0
e0
Length
40 mm
40 mm
Moisture Sensitivity Level
4
4
Number of CLBs
11648
11648
Number of Equivalent Gates
8000000
8000000
Number of Inputs
1108
1108
Number of Logic Cells
104832
104832
Number of Outputs
1108
1108
Number of Terminals
1517
1517
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
11648 CLBS, 8000000 GATES
11648 CLBS, 8000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1517,39X39,40
BGA1517,39X39,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.4 mm
3.4 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
40 mm
40 mm
Base Number Matches
1
1
Compare XC2V8000-4FF1517C with alternatives
Compare XC2V8000-5FF1517C with alternatives