XC2V500-5FGG456I
vs
XC2V500-5FG456C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
23 X 23 MM, 1 MM PITCH, LEAD FREE, MO-034AAJ-1, FBGA-456
23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456
Pin Count
456
456
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
750 MHz
750 MHz
Combinatorial Delay of a CLB-Max
0.39 ns
0.39 ns
JESD-30 Code
S-PBGA-B456
S-PBGA-B456
JESD-609 Code
e1
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
768
768
Number of Equivalent Gates
500000
500000
Number of Inputs
264
264
Number of Logic Cells
6912
6912
Number of Outputs
264
264
Number of Terminals
456
456
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
768 CLBS, 500000 GATES
768 CLBS, 500000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA456,22X22,40
BGA456,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
1
1
Temperature Grade
OTHER
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