XC2V4000-6BFG957C
vs
XC2V4000-5BFG957C
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957
40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957
Pin Count
957
957
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
820 MHz
750 MHz
Combinatorial Delay of a CLB-Max
0.35 ns
0.39 ns
JESD-30 Code
S-PBGA-B957
S-PBGA-B957
JESD-609 Code
e1
e1
Length
40 mm
40 mm
Moisture Sensitivity Level
4
4
Number of CLBs
5760
5760
Number of Equivalent Gates
4000000
4000000
Number of Inputs
684
684
Number of Logic Cells
51840
51840
Number of Outputs
684
684
Number of Terminals
957
957
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
5760 CLBS, 4000000 GATES
5760 CLBS, 4000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA957,31X31,50
BGA957,31X31,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
40 mm
40 mm
Base Number Matches
1
1
Compare XC2V4000-6BFG957C with alternatives
Compare XC2V4000-5BFG957C with alternatives