XC2V1500-4FFG896I
vs
XC2V1500-4FFG896C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896
31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896
Pin Count
896
896
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
650 MHz
650 MHz
Combinatorial Delay of a CLB-Max
0.44 ns
0.44 ns
JESD-30 Code
S-PBGA-B896
S-PBGA-B896
JESD-609 Code
e1
e1
Length
31 mm
31 mm
Moisture Sensitivity Level
4
4
Number of CLBs
1920
1920
Number of Equivalent Gates
1500000
1500000
Number of Inputs
528
528
Number of Outputs
528
528
Number of Terminals
896
896
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1920 CLBS, 1500000 GATES
1920 CLBS, 1500000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA896,30X30,40
BGA896,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.4 mm
3.4 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
31 mm
31 mm
Base Number Matches
1
1
Temperature Grade
OTHER
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