XC2V1000-6BGG575I vs XQR2V1000-4BG575N feature comparison

XC2V1000-6BGG575I AMD Xilinx

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XQR2V1000-4BG575N AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA575,24X24,50 1.27 MM PITCH, PLASTIC, MS-034BAN-1, BGA-575
Pin Count 575 575
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 820 MHz 650 MHz
Combinatorial Delay of a CLB-Max 0.35 ns 0.44 ns
JESD-30 Code S-PBGA-B575 S-PBGA-B575
JESD-609 Code e1 e0
Length 31 mm 31 mm
Number of CLBs 1280 1280
Number of Equivalent Gates 1000000 1000000
Number of Inputs 328 328
Number of Logic Cells 11520 11520
Number of Outputs 328 328
Number of Terminals 575 575
Operating Temperature-Max 100 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 1280 CLBS, 1000000 GATES 1280 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA575,24X24,50 BGA575,24X24,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 31 mm 31 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Temperature Grade MILITARY

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