XC2V1000-4BG575C vs XQR2V1000-4BGG575R feature comparison

XC2V1000-4BG575C AMD Xilinx

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XQR2V1000-4BGG575R AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575 BGA,
Pin Count 575 575
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 650 MHz 650 MHz
Combinatorial Delay of a CLB-Max 0.44 ns 0.44 ns
JESD-30 Code S-PBGA-B575 S-PBGA-B575
JESD-609 Code e0 e1
Length 31 mm 31 mm
Moisture Sensitivity Level 3
Number of CLBs 1280 1280
Number of Equivalent Gates 1000000 1000000
Number of Inputs 328
Number of Logic Cells 11520
Number of Outputs 328
Number of Terminals 575 575
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -55 °C
Organization 1280 CLBS, 1000000 GATES 1280 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA575,24X24,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER MILITARY
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 31 mm 31 mm
Base Number Matches 1 1

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