XC2S600E-7FGG676C
vs
XC2S600E-6FGG676C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
LEAD FREE, FBGA-676
LEAD FREE, FBGA-676
Pin Count
676
676
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
MAXIMUM USABLE GATES = 150000
MAXIMUM USABLE GATES = 600000
Clock Frequency-Max
357 MHz
357 MHz
Combinatorial Delay of a CLB-Max
0.47 ns
0.47 ns
JESD-30 Code
S-PBGA-B676
S-PBGA-B676
JESD-609 Code
e1
e1
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
864
3456
Number of Equivalent Gates
52000
210000
Number of Inputs
514
514
Number of Logic Cells
15552
15552
Number of Outputs
514
514
Number of Terminals
676
676
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
864 CLBS, 52000 GATES
3456 CLBS, 210000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA676,26X26,40
BGA676,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.89 V
1.89 V
Supply Voltage-Min
1.71 V
1.71 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
OTHER
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
27 mm
Base Number Matches
1
1
Compare XC2S600E-7FGG676C with alternatives
Compare XC2S600E-6FGG676C with alternatives