XC2S600E-6FG456C vs XC2S600E-6FGG456I feature comparison

XC2S600E-6FG456C AMD Xilinx

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XC2S600E-6FGG456I AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-456 LEAD FREE, FBGA-456
Pin Count 456 456
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAXIMUM USABLE GATES = 600000 MAXIMUM USABLE GATES = 150000
Clock Frequency-Max 357 MHz 357 MHz
Combinatorial Delay of a CLB-Max 0.47 ns 0.47 ns
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3456 864
Number of Equivalent Gates 210000 52000
Number of Inputs 514 514
Number of Logic Cells 15552 15552
Number of Outputs 514 514
Number of Terminals 456 456
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 3456 CLBS, 210000 GATES 864 CLBS, 52000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,22X22,40 BGA456,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1

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