XC2S100-5FG256Q
vs
XCV100-5FGG256C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
FBGA-256
FBGA-256
Pin Count
256
256
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
263 MHz
294 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
600
600
Number of Equivalent Gates
100000
108904
Number of Inputs
180
176
Number of Logic Cells
2700
Number of Outputs
176
176
Number of Terminals
256
256
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
600 CLBS, 100000 GATES
600 CLBS, 108904 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
2 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
OTHER
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
17 mm
17 mm
Base Number Matches
1
1
Combinatorial Delay of a CLB-Max
0.7 ns
Compare XC2S100-5FG256Q with alternatives
Compare XCV100-5FGG256C with alternatives