XC2C64A-7CPG56I vs XC2C64-5CPG56C feature comparison

XC2C64A-7CPG56I AMD Xilinx

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XC2C64-5CPG56C AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56 6 X 6 MM, 0.50 MM PITCH, CSP-56
Pin Count 56 56
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 30 Weeks
Additional Feature REAL DIGITAL DESIGN TECHNOLOGY REAL DIGITAL DESIGN TECHNOLOGY
Clock Frequency-Max 200 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B56 S-PBGA-B56
JESD-609 Code e1 e1
JTAG BST YES YES
Length 6 mm 6 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 45 45
Number of Macro Cells 64 64
Number of Terminals 56 56
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 45 I/O 0 DEDICATED INPUTS, 45 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA56,10X10,20 BGA56,10X10,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 7.5 ns 5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm 1.35 mm
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 6 mm 6 mm
Base Number Matches 1 1

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