XC2C384-7FG324C
vs
XC2C384-7FGG324C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
23 X 23 MM, 1 MM PITCH, FBGA-324
23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-324
Pin Count
324
324
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
YES
Architecture
PLA-TYPE
PLA-TYPE
Clock Frequency-Max
112 MHz
112 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e0
e1
JTAG BST
YES
YES
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
240
240
Number of Inputs
240
240
Number of Macro Cells
384
384
Number of Outputs
240
240
Number of Terminals
324
324
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
0 DEDICATED INPUTS, 240 I/O
0 DEDICATED INPUTS, 240 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA324,22X22,40
BGA324,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
250
Programmable Logic Type
FLASH PLD
FLASH PLD
Propagation Delay
7.5 ns
7.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.5 mm
2.5 mm
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
2
2
Factory Lead Time
12 Weeks
Compare XC2C384-7FG324C with alternatives
Compare XC2C384-7FGG324C with alternatives