XC2C32A-6CPG56I vs XC2C32A-4CP56C feature comparison

XC2C32A-6CPG56I AMD Xilinx

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XC2C32A-4CP56C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56 6 X 6 MM, 0.50 MM PITCH, CSP-56
Pin Count 56 56
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 30 Weeks 30 Weeks
Additional Feature REAL DIGITAL DESIGN TECHNOLOGY REAL DIGITAL DESIGN TECHNOLOGY
Clock Frequency-Max 300 MHz 450 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B56 S-PBGA-B56
JESD-609 Code e1 e0
JTAG BST YES YES
Length 6 mm 6 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 33 33
Number of Macro Cells 32 32
Number of Terminals 56 56
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 33 I/O 33 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA56,10X10,20 BGA56,10X10,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 240
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 6 ns 4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm 1.35 mm
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 6 mm 6 mm
Base Number Matches 1 1

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