XC2C32A-6CPG56C
vs
XC2C32-6CPG56I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
XILINX INC
Package Description
6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56
6 X 6 MM, 0.50 MM PITCH, CSP-56
Reach Compliance Code
compliant
unknown
Samacsys Manufacturer
AMD
Additional Feature
REAL DIGITAL DESIGN TECHNOLOGY
REAL DIGITAL DESIGN TECHNOLOGY
Clock Frequency-Max
300 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B56
S-PBGA-B56
JESD-609 Code
e1
e1
JTAG BST
YES
YES
Length
6 mm
6 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
33
33
Number of Macro Cells
32
32
Number of Terminals
56
56
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
33 I/O
1 DEDICATED INPUTS, 33 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA56,10X10,20
BGA56,10X10,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Programmable Logic Type
FLASH PLD
FLASH PLD
Propagation Delay
6 ns
6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.35 mm
1.35 mm
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
6 mm
6 mm
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
56
HTS Code
8542.39.00.01
Number of Dedicated Inputs
1
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