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XC2C32-3CP56C vs XC2C32A-4CP56C feature comparison

XC2C32-3CP56C AMD Xilinx

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XC2C32A-4CP56C AMD

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Rohs Code No No
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description 6 X 6 MM, 0.50 MM PITCH, CSP-56 6 X 6 MM, 0.50 MM PITCH, CSP-56
Pin Count 56
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01
Additional Feature REAL DIGITAL DESIGN TECHNOLOGY REAL DIGITAL DESIGN TECHNOLOGY
In-System Programmable YES YES
JESD-30 Code S-PBGA-B56 S-PBGA-B56
JESD-609 Code e0 e0
JTAG BST YES YES
Length 6 mm 6 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 1
Number of I/O Lines 33 33
Number of Macro Cells 32 32
Number of Terminals 56 56
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1 DEDICATED INPUTS, 33 I/O 33 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA56,10X10,20 BGA56,10X10,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 240 240
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 3 ns 4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm 1.35 mm
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 6 mm 6 mm
Base Number Matches 1 2
Samacsys Manufacturer AMD
Clock Frequency-Max 450 MHz
Programmable Logic » Programmable Logic Devices
Programmable Logic » Programmable Logic Devices

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