XC2C256-7FT256I
vs
XC2C256-7FT256C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
17 X 17 MM, 1 MM PITCH, FTBGA-256
17 X 17 MM, 1 MM PITCH, FTBGA-256
Pin Count
256
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
Factory Lead Time
42 Weeks
Additional Feature
REAL DIGITAL DESIGN TECHNOLOGY
REAL DIGITAL DESIGN TECHNOLOGY
Architecture
PLA-TYPE
PLA-TYPE
Clock Frequency-Max
108 MHz
108 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
JTAG BST
YES
YES
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
184
184
Number of Inputs
184
184
Number of Macro Cells
256
256
Number of Outputs
184
184
Number of Terminals
256
256
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
0 DEDICATED INPUTS, 184 I/O
0 DEDICATED INPUTS, 184 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FLASH PLD
FLASH PLD
Propagation Delay
7.5 ns
7.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
17 mm
Base Number Matches
2
2
Samacsys Manufacturer
AMD
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