XC18V256PC20C vs XC18V512PC20C0936 feature comparison

XC18V256PC20C AMD Xilinx

Buy Now Datasheet

XC18V512PC20C0936 AMD Xilinx

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code QLCC QLCC
Package Description PLASTIC, LCC-20 QCCJ,
Pin Count 20 20
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 3A991.B.1.B.2
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 15 ns 15 ns
Clock Frequency-Max (fCLK) 33 MHz
Data Retention Time-Min 10
Endurance 10000 Write/Erase Cycles
JESD-30 Code S-PQCC-J20 S-PQCC-J20
JESD-609 Code e0 e0
Length 8.9662 mm 8.9662 mm
Memory Density 262144 bit 524288 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 32768 words 65536 words
Number of Words Code 32000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 64KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC20,.4SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL/SERIAL PARALLEL/SERIAL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.572 mm
Standby Current-Max 0.01 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE
Width 8.9662 mm 8.9662 mm
Base Number Matches 1 1
Pbfree Code No

Compare XC18V256PC20C with alternatives

Compare XC18V512PC20C0936 with alternatives