XC18V128PC20C
vs
XC1701PC20C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
XILINX INC
ROCHESTER ELECTRONICS LLC
Part Package Code
QLCC
QLCC
Package Description
QCCJ,
PLASTIC, LCC-20
Pin Count
20
20
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
20 ns
JESD-30 Code
S-PQCC-J20
S-PQCC-J20
Length
8.9662 mm
8.9662 mm
Memory Density
131072 bit
1048576 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
20
20
Number of Words
131072 words
1048576 words
Number of Words Code
128000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX1
1MX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL/SERIAL
SERIAL
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
4.572 mm
4.572 mm
Supply Voltage-Max (Vsup)
3.6 V
5.25 V
Supply Voltage-Min (Vsup)
3 V
4.75 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
8.9662 mm
8.9662 mm
Base Number Matches
1
2
Pbfree Code
Rohs Code
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-609 Code
e0
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
30
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