XC18V01PCG20C0901 vs XC18V01SOG20C0936 feature comparison

XC18V01PCG20C0901 AMD Xilinx

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XC18V01SOG20C0936 AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code QLCC SOIC
Package Description PLASTIC, LCC-20 SOP,
Pin Count 20 20
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.1.B.2 3A991.B.1.B.2
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 15 ns 15 ns
JESD-30 Code S-PQCC-J20 R-PDSO-G20
JESD-609 Code e3 e3
Length 8.9662 mm 12.8 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 128KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ SOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE
Parallel/Serial PARALLEL/SERIAL PARALLEL/SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 2.65 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD DUAL
Width 8.9662 mm 7.5 mm
Base Number Matches 1 1

Compare XC18V01PCG20C0901 with alternatives

Compare XC18V01SOG20C0936 with alternatives