XC1801PC20C vs XC18256PC20I feature comparison

XC1801PC20C AMD Xilinx

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XC18256PC20I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code QLCC QLCC
Package Description PLASTIC, LCC-20 PLASTIC, LCC-20
Pin Count 20 20
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.B.1.B.2 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 45 ns 45 ns
Additional Feature SERIAL MODE ALSO AVAILABLE SERIAL MODE ALSO AVAILABLE
Clock Frequency-Max (fCLK) 15 MHz 15 MHz
Data Retention Time-Min 10 10
Endurance 10000 Write/Erase Cycles 10000 Write/Erase Cycles
JESD-30 Code S-PQCC-J20 S-PQCC-J20
JESD-609 Code e0 e0
Length 8.9662 mm 8.9662 mm
Memory Density 1048576 bit 262144 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 1048576 words 262144 words
Number of Words Code 1000000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX1 256KX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC20,.4SQ LDCC20,.4SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.57 mm
Standby Current-Max 0.0001 A 0.0001 A
Supply Current-Max 0.03 mA 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Type NOR TYPE NOR TYPE
Width 8.9662 mm 8.9662 mm
Base Number Matches 1 1

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