XC17V08PC44C vs AM27X800-200JC feature comparison

XC17V08PC44C AMD Xilinx

Buy Now Datasheet

AM27X800-200JC AMD

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Part Package Code LCC LCC
Package Description PLASTIC, LCC-44 QCCJ, LDCC44,.7SQ
Pin Count 44 44
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.1.B.1 EAR99
HTS Code 8542.32.00.51 8542.32.00.71
Factory Lead Time 4 Weeks
Clock Frequency-Max (fCLK) 20 MHz
I/O Type COMMON
JESD-30 Code S-PQCC-J44 S-PQCC-J44
JESD-609 Code e0 e0
Length 16.5862 mm 16.5862 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type CONFIGURATION MEMORY OTP ROM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX8 1MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC44,.7SQ LDCC44,.7SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL/SERIAL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.57 mm
Standby Current-Max 0.001 A 0.0001 A
Supply Current-Max 0.1 mA 0.05 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 16.5862 mm 16.5862 mm
Base Number Matches 1 1
Access Time-Max 200 ns
Additional Feature EXPRESS
Alternate Memory Width 16

Compare XC17V08PC44C with alternatives

Compare AM27X800-200JC with alternatives