XC17V04PCG44C
vs
XC17V04PCG44I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
LCC
LCC
Package Description
QCCJ,
QCCJ,
Pin Count
44
44
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.1.B.1
3A991.B.1.B.1
HTS Code
8542.32.00.51
8542.32.00.51
JESD-30 Code
S-PQCC-J44
S-PQCC-J44
JESD-609 Code
e3
e3
Length
16.5862 mm
16.5862 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX1
4MX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
245
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
4.57 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
16.5862 mm
16.5862 mm
Base Number Matches
1
1
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