XC17V04PCG20I vs AT17F040-10BJI feature comparison

XC17V04PCG20I AMD Xilinx

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AT17F040-10BJI Atmel Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC ATMEL CORP
Part Package Code QLCC QLCC
Package Description QCCJ, QCCJ, LDCC20,.4SQ
Pin Count 20 20
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.1.B.1 3A991.B.1.B.1
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code S-PQCC-J20 S-PQCC-J20
JESD-609 Code e3 e0
Length 8.9662 mm 8.965 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 2
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX1 4MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 245 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.572 mm
Supply Voltage-Max (Vsup) 3.6 V 3.63 V
Supply Voltage-Min (Vsup) 3 V 2.97 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 8.9662 mm 8.965 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 33 MHz
Package Equivalence Code LDCC20,.4SQ
Standby Current-Max 0.0001 A
Supply Current-Max 0.005 mA

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