XC17V04PCG20C
vs
XCF04SVO20C0936
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
QLCC
TSSOP
Package Description
QCCJ,
TSSOP,
Pin Count
20
20
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.1.B.1
3A991.B.1.B.1
HTS Code
8542.32.00.51
8542.32.00.51
JESD-30 Code
S-PQCC-J20
R-PDSO-G20
JESD-609 Code
e3
e0
Length
8.9662 mm
6.5024 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
20
20
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX1
4MX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
TSSOP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
1.19 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
8.9662 mm
4.4 mm
Base Number Matches
1
1
Compare XC17V04PCG20C with alternatives
Compare XCF04SVO20C0936 with alternatives