XC17V04PC20I vs XCF04SVO20CES feature comparison

XC17V04PC20I AMD Xilinx

Buy Now Datasheet

XCF04SVO20CES AMD Xilinx

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code QLCC TSSOP
Package Description PLASTIC, LCC-20 TSSOP,
Pin Count 20 20
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 3A991.B.1.B.1
HTS Code 8542.32.00.61 8542.32.00.51
Clock Frequency-Max (fCLK) 15 MHz
I/O Type COMMON
JESD-30 Code S-PQCC-J20 R-PDSO-G20
JESD-609 Code e0 e0
Length 8.9662 mm 6.5024 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX1 4MX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ TSSOP
Package Equivalence Code LDCC20,.4SQ
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 1.19 mm
Standby Current-Max 0.001 A
Supply Current-Max 0.015 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 8.9662 mm 4.4 mm
Base Number Matches 1 1

Compare XC17V04PC20I with alternatives

Compare XCF04SVO20CES with alternatives