XC17V01SOG20C vs XCF01SVOG20CES feature comparison

XC17V01SOG20C AMD Xilinx

Buy Now Datasheet

XCF01SVOG20CES AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code SOIC TSSOP
Package Description SOP, TSSOP,
Pin Count 20 20
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e3 e3
Length 12.8 mm 6.5024 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX1 1MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 1.19 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 7.5 mm 4.4 mm
Base Number Matches 1 1

Compare XC17V01SOG20C with alternatives

Compare XCF01SVOG20CES with alternatives