XC17S20PDG8C
vs
XC17S150XLPDG8I
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP,
|
DIP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e3
|
Length |
9.3599 mm
|
9.3599 mm
|
Memory Density |
178144 bit
|
1040128 bit
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Memory Width |
1
|
1
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
178144 words
|
1040128 words
|
Number of Words Code |
178144
|
1040128
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
178144X1
|
1040128X1
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.5974 mm
|
4.5974 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare XC17S20PDG8C with alternatives
Compare XC17S150XLPDG8I with alternatives