XC17S150XLSO20C vs XC17S150XLSOG20C feature comparison

XC17S150XLSO20C AMD Xilinx

Buy Now Datasheet

XC17S150XLSOG20C AMD Xilinx

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code SOIC SOIC
Package Description PLASTIC, SOP-20 SOP,
Pin Count 20 20
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Factory Lead Time 4 Weeks
Clock Frequency-Max (fCLK) 10 MHz
I/O Type COMMON
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e3
Length 12.8 mm 12.8 mm
Memory Density 1040128 bit 1040128 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 1040128 words 1040128 words
Number of Words Code 1040128 1040128
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1040128X1 1040128X1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 7.5 mm 7.5 mm
Base Number Matches 1 1
Pbfree Code Yes